Samsung expands foundry capacity and prepares 2nm chips. Samsung has reported that it is preparing 2nm production processes and that chips with this node will be the basis of products that we will probably see in 2025.
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Specific announcements came from the company itself as part of the Samsung Foundry Forum which took place in San Jose (California).
From what has emerged, it can be seen that the company plans for next year processors for smartphones and tablets with process nodes based on 2 nanometers.
The unit of measurement of nanometers in the electronic field refers to the architecture used in the CPUs, or rather to the length of the transistors that make up the chips, an ever more extreme miniaturization that allows for an increase in the number of transistors with consequent improvements in terms of performance and energy efficiency.
Samsung Foundry, the Korean giant’s contract chip business unit, offers its foundry to customers such as Qualcomm and Samsung’s smartphone business unit.
After 2025, Samsung has reported that it intends to dedicate 2nm production to high-performance computing, and that in 2026 and 2027 this production node can also be exploited by the automotive sector.
According to the South Korean company, the 2nm node allows for improvements of 12% in terms of performance and 25% in terms of energy efficiency, compared to 3nm nodes; the 2nm construction process will also make it possible to create chips that are 5% smaller than those that can be created with 3nm.
By 2027, the company expects to be able to produce chips using a 1.4nm manufacturing node.
By 2025, Samsung said it will offer contract manufacturing of gallium nitride (GaN) semiconductor power management chips and 5nm RF chips. The company also said it will begin offering 8nm and 14nm RF chips for automotive applications.
The manufacturer also reported the expansion of its clean rooms by 2027, with the expansion of its Pyeongtaek fabs – billed as the most advanced facility of its type – and new fabs to be built in Taylor (Texas). More space for clean rooms that allow you to avoid contamination of the components or delicate machinery involved, means more ability to fulfill customer orders.
Another announcement is the formation of the Multi-Die Integration Alliance, an alliance with partners that provides for the creation of new technologies for chip packaging. Samsung, we recall, is the second largest independent semiconductor manufacturer in the world, after TSMC (the company that produces, on behalf of Apple, the Ax chips of the iPhone and the Mx chips of the Mac).
